Let me take you into the world of industrial automation
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PCM-9376
AMD G-Series 单核T16R 处理器 + A55E, DDR3 SODIMM 最高可达4GB
支持DirectX11, 48-bit LVDS, VGA, 18-bit TTL
双GbE, 4个COM, 2个SATA, mSATA
扩展: PC/104, Mini PCIe, LPC(可扩展COM)
支持 iManager, SUSIAccess 和嵌入式软件 API
规格

Part Number

PCM-9376E-1GM0A1E

PCM-9376E-M0A1E

PCM-9376E-S0A1E

Processor

CPU

AMD® G-Series™ T16R

AMD® G-Series™ T16R

AMD® G-Series™ T40E

Core Number

1

1

2

Frequency

615MHz

615MHz

1.0 GHz

L2 Cache

512 KB

512 KB

512 KB

Chipset

AMD T16R + A55E

AMD T16R + A55E

AMD T40E + A55E

BIOS

AMI 32 Mbit

AMI 32 Mbit

AMI 32 Mbit

Memory

Technology

DDR3/DDR3L 1066 MHz

DDR3/DDR3L 1066 MHz

DDR3/DDR3L 1066 MHz

Max. Capacity

on-board 1GB

SODIMM up to 4 GB

SODIMM up to 4 GB

Recommended DRAM

AQD-SD3L4GN16-SQ

AQD-SD3L4GN16-SQ

AQD-SD3L4GN16-SQ

Socket

-

1 x 204-pin SODIMM

1 x 204-pin SODIMM

On-board SDRAM

1 GB

-

-

Display

Chipset

AMD T16R processor

AMD T16R processor

AMD T40Eprocessor

Graphic Engine

DirectX 11 graphics with UVD 3.0, Open CL 1.1, Open GL 4.0 Hardware decode (UVD 3) for H.264, VC-1 and MPEG2

DirectX 11 graphics with UVD 3.0, Open CL 1.1, Open GL 4.0 Hardware decode (UVD 3) for H.264, VC-1 and MPEG2

DirectX 11 graphics with UVD 3.0, Open CL 1.1, Open GL 4.0 Hardware decode (UVD 3) for H.264, VC-1 and MPEG2

VRAM

Optimized shared memory Architecture up to 384 MB system memory

Optimized shared memory Architecture up to 384 MB system memory

Optimized shared memory Architecture up to 384 MB system memory

LVDS

48-bit LVDS up to 1920 x 1200 at 60Hz

48-bit LVDS up to 1920 x 1200 at 60Hz

48-bit LVDS up to 1920 x 1200 at 60Hz

VGA

Up to 1920 x 1200 at 85Hz

Up to 1920 x 1200 at 85Hz

Up to 1920 x 1200 at 85Hz

TTL

-

-

-

Dual Display

VGA+LVDS, VGA+TTL, LVDS+TTL

VGA+LVDS, VGA+TTL, LVDS+TTL

VGA+LVDS, VGA+TTL, LVDS+TTL

Ethernet

Speed

10/ 100/ 1000 Mbps

10/ 100/ 1000 Mbps

10/ 100/ 1000 Mbps

Controller

GbE1/2: Realtek RTL8111E-VL-CG

GbE1/2: Realtek RTL8111E-VL-CG

GbE1/2: Realtek RTL8111E-VL-CG

Connector

GbE1 on RJ-45, GbE2 on box wafer

GbE1 on RJ-45, GbE2 on box wafer

GbE1 on RJ-45, GbE2 on box wafer

Audio

Chipset

ALC892 Codec (Line-in, line-out, mic-in)

ALC892 Codec (Line-in, line-out, mic-in)

ALC892 Codec (Line-in, line-out, mic-in)

Watchdog Timer

255 levels timer interval, programmable by software, multi-level WDT set by iManager

255 levels timer interval, programmable by software, multi-level WDT set by iManager

255 levels timer interval, programmable by software, multi-level WDT set by iManager

Storage

SATA

2 SATA II (Max. Data Transfer Rate 300 MB/s)

2 SATA II (Max. Data Transfer Rate 300 MB/s)

2 SATA II (Max. Data Transfer Rate 300 MB/s)

mSATA

1 (Full-size, Mini PCIe supported by request)

1 (Full-size, Mini PCIe supported by request)

1 (Full-size, Mini PCIe supported by request)

Rear I/O

Serial

1 (COM1: RS-232/422/485, supports WoR and RS-485's auto flow control) (ESD protection: air gap ±15kV, contact ±8kV)

1 (COM1: RS-232/422/485, supports WoR and RS-485's auto flow control) (ESD protection: air gap ±15kV, contact ±8kV)

1 (COM1: RS-232/422/485, supports WoR and RS-485's auto flow control) (ESD protection: air gap ±15kV, contact ±8kV)

Ethernet

1

1

1

PS/2 KB/Mouse

1

1

1

VGA

1

1

1

Reset Button

1

1

1

Internal I/O

Ethernet

1

1

1

USB

4 x USB2.0

4 x USB2.0

4 x USB2.0

Serial

3 (COM2: RS-232/422/485, supports RS-485 auto flow control. COM3/4: RS-232) (ESD protection: air gap ±15kV, contact ±8kV)

3 (COM2: RS-232/422/485, supports RS-485 auto flow control. COM3/4: RS-232) (ESD protection: air gap ±15kV, contact ±8kV)

3 (COM2: RS-232/422/485, supports RS-485 auto flow control. COM3/4: RS-232) (ESD protection: air gap ±15kV, contact ±8kV)

SMBus

1

1

1

I2C

1 (Share with SMBus)

1 (Share with SMBus)

1 (Share with SMBus)

GPIO

8-bit (5V tolerance)

8-bit (5V tolerance)

8-bit (5V tolerance)

Expansion

PC/104

1 (8/16-bit ISA) (Booted and powered from PC/104 supports by request)

1 (8/16-bit ISA) (Booted and powered from PC/104 supports by request)

1 (8/16-bit ISA) (Booted and powered from PC/104 supports by request)

Mini PCIe

1 (Half-size)

1 (Half-size)

1 (Half-size)

LPC

1 (For support of COM ports by PCA-COM232 or PCA-COM485)

1 (For support of COM ports by PCA-COM232 or PCA-COM485)

1 (For support of COM ports by PCA-COM232 or PCA-COM485)

Power

Power Type

AT/ATX

AT/ATX

AT/ATX

Power Supply Voltage

5V ±5% (12V only for LCD and PC/104)

5V ±5% (12V only for LCD and PC/104)

5V ±5% (12V only for LCD and PC/104)

Power Consumption (Typical)

1.44@5V (7.2W)

1.44@5V (7.2W)

1.47A@5V (7.35W)

Power Consumption (Max)

1.89A@5V (9.45)

1.89A@5V (9.45)

2.13A@5V (10.65)

Power Management

ACPI

ACPI

ACPI

Battery

Lithium 3 V / 210 mAH

Lithium 3 V / 210 mAH

Lithium 3 V / 210 mAH

Environment

Operational Temperature

0 ~ 60° C (32 ~ 140° F) (Operational humidity: 40° C @ 85% RH non-condensing)

0 ~ 60° C (32 ~ 140° F) (Operational humidity: 40° C @ 85% RH non-condensing)

0 ~ 60° C (32 ~ 140° F) (Operational humidity: 40° C @ 85% RH non-condensing)

Non-Operational Temperature

-40 ~ 85° C and 60° C @ 95% RH Non-Condensing

-40 ~ 85° C and 60° C @ 95% RH Non-Condensing

-40 ~ 85° C and 60° C @ 95% RH Non-Condensing

Physical

Dimension (mm)

146 x 102 mm (5.7" x 4")

146 x 102 mm (5.7" x 4")

146 x 102 mm (5.7" x 4")

Weight

0.51 kg (1.12 lb) for total package

0.51 kg (1.12 lb) for total package

0.51 kg (1.12 lb) for total package

Total Height

23.9 mm (including of heatsink)

23.9 mm (including of heatsink)

23.9 mm (including of heatsink)